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Dresden, Germany, June 2nd - 5th, 2024 (in person only event)
 IEEE


DTIP survey for 2024 edition is closed. 

The results can be read >>> here <<< 

Chairs

  • General Chair:
    Emile Martincic, Univ. Paris-Saclay
  • Vice-General Chair:
    Pascal Nouet, Univ. Montpellier
  • Publication Chair:
  • Corinne Dejous, Univ. Bordeaux
  • Local Chairs:
  • Peter Schneider, Fraunhofer Dresden
  • Uwe Marschner, Fraunhofer Dresden

Contact information

What's new?

  • Dec. 15th, 2023: 1st announcement
  •                              and save the date 
  • Jan. 19th, 2024: call for papers
    • Feb. 20th, 2024: 2nd call for papers
    • Mar. 1st, 2024: Deadline extension to 
    •                             Mar. 15th
    • Mar. 15th, 2024: 2nd deadline extension to Mar. 22nd
    • Apr. 11th, 2024: Registration is open
    • Apr. 17th, 2024: Decision is made
    • Apr. 19th, 2024: Program 1st draft is online
    • May 30th, 2024: Program updated
    • Nov 14th, 2024: Survey results published
  •  

ABOUT THE DTIP SYMPOSIUM

DTIP'2024 will be the 26th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in a single track Conference. After the successful 2023 edition in Malta, the 2024 edition will take place in the city of Dresden, Germany. 

We look forward to meeting you in Dresden ...
Emile Martincic & Pascal Nouet

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