Computer-Aided Design, Design and Test
Conference
- Chair: Marta Rencz, BME, Hungary
- Co-Chair: Francis Pressecq, CNES, France
This Conference will bring together researchers, engineers
and practitioners involved in the development of CAD tools and design
methodologies for MEMS and MOEMS.
Topics of Interest
- Technology CAD in general
- Modeling and simulation of fabrication processes
- Devices and components (sensors, actuators, …)
- MEMS/MOEMS libraries and IP
- Signal processing
- Integrated CAD tools
- Numerical simulation
- Yield estimation
- Failure mechanisms
- Fault modeling
- Fault simulation and test pattern generation
- Mechanical simulation
- Thermal evaluation
- Interoperability of CAD/CAE tools
- Multiphysics simulation
- Structured design methodologies
- Languages for interchange data among designs and tools
- Model order reduction
Program Committee
- Shuhei AMAKAWA, Hiroshima University, Japan
- Arturo AYON, Univ. of Texas at San Antonio, USA
- Elena BLOKHINA, University College Dublin, Ireland
- Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
- Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
- Péter FURJES, Institute for Technical Physics and Materials
Science, Hungary
- Dimitri GALAYKO, Pierre and Marie Curie Univ., Paris VI,
France, France
- Jerome JUILLARD, Supélec, France
- Raphaël LEVY, ONERA, France
- Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
- Frédérick MAILLY, LIRMM, University of Montpellier, France
- Romolo MARCELLI, CNR-IMM Roma, Italy
- Mohamed MASMOUDI, University of Sfax, Tunisia
- Raluca MULLER, IMT - Bucharest, Romania
- Anis Nurashikin NORDIN, International Islamic University,
Malaysia
- Andrew RICHARDSON, Lancaster University, UK
- Bart ROMANOWICZ, Nano Science & Technology Institute,
Austin, USA
- Ray ROOP, Freescale Semiconductor, USA
- Libor RUFER, University of Grenoble, France
- Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
- Gerold SCHROEPFER, Coventor, France
- Mahnaz SHAMSHIRSAZ, Amirkabir University of Technology, Iran
- Jian ZHU, Nanjing Electronic Devices Institute, China
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Microfabrication, Integration and
Packaging Conference
- Chair: Yoshio Mita, University of Tokyo,
Japan
- Co-Chair: Peter Schneider, Fraunhofer
IIS/EAS, Dresden, Germany
This Conference will bring together researchers, engineers
and practitioners involved in the development of integration
technologies and packaging for MEMS and MOEMS.
Topics of Interest
- Integrated processes (micromachining, micromolding, …)
- Process integration between MEMS and electronics
- Microlithography issues unique to MEMS/MOEMS
- Manufacturing
- Materials
- Assembly technologies
- Packaging for harsh environments
- MOEMS packaging
- RF and microwave packaging
- Test structures
- Devices and components (sensors, actuators, …)
- Dimensional measurements
- Physical measurements
- Failure analysis
- Reliability
- Characterization
- Process monitoring
- Non destructive evaluation
Program Committee
- Knut AASMUNDTVEIT, HBV, Buskerud and Vestfold University
College, Norway
- Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
- Philippe BASSET, Université Paris-Est / ESYCOM / ESIEE
Paris, France
- Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
- Victor BRIGHT, Univ. of Colorado Boulder, USA
- Henri CAMON, LAAS-CNRS, France
- Benoit CHARLOT, IES, CNRS/Université Montpellier, France
- Alexandra GARRAUD, University of Florida, USA
- Toshihiro ITOH, AIST (National Institute of Advanced
Industrial Science and Technology), Japan
- Elie LEFEUVRE, Université Paris Sud - CNRS, France
- Alan MATHEWSON, Tyndall National Institute, Ireland
- Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
- Yves-Alain PETER, EPM, Montréal, Canada, Canada
- Emanuela PROIETTI, Institute for Microelectronics and
Microsystems, Roma, Italy
- Xuechuan SHAN, SIMTech, Singapore, Singapore
- Diana STRICKLAND, Southwest Research Institute, San
Antionio, USA
- Andrew A O TAY, National Univ. of Singapore, Singapore
- Li TIE, SIMIT, CAS, China
- Dong F. WANG, Jilin Univ., Changchun, China
- Gou-Jen WANG, National Chung-Hsing University, Taiwan
- Matthias WORGULL, KIT, Karlsruhe, Germany
- Hsiharng YANG, National Chung Hsing Univ., Taiwan, Taiwan
- Xuming ZHANG, Hong Kong Polytechnic university, Hong-Kong
- Christian A. ZORMAN, Case Western Reserve Univ., Cleveland,
USA
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