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Montpellier - France, 27 - 30 April 2015
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In 2015, DTIP Symposium will host two Conferences, one special session and some plenary sessions.

Special Session on "Co-design for MEMS based Smart Systems", organized by Dr. Gerold Schröpfer (Coventor)
The advancement in MEMS technology have led to a broad range of emerging applications of microelectronic systems allowing a tighter interaction with the surrounding environment and involving different physical domains (optical, mechanical, acoustical, biological, etc.). The design and verification of these MEMS assisted systems is often an iterative process, in which the individual parts for each physical domain are developed independently and then combined in the very last stage to realize the final product. In this special session we like to address new developments in terms of methodology and tools to address the design of the next generation of MEMS-based smart systems. Contributions are expected in the area of co-simulation, co-design, new modeling and design techniques to enable multi-domain simulation and optimization at various levels of abstraction including component and system level.

Computer-Aided Design, Design and Test Conference

  • Chair: Marta Rencz, BME, Hungary

  • Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Topics of Interest

  • Technology CAD in general
  • Modeling and simulation of fabrication processes
  • Devices and components (sensors, actuators, …)
  • MEMS/MOEMS libraries and IP
  • Signal processing
  • Integrated CAD tools
  • Numerical simulation
  • Yield estimation
  • Failure mechanisms
  • Fault modeling
  • Fault simulation and test pattern generation
  • Mechanical simulation
  • Thermal evaluation
  • Interoperability of CAD/CAE tools
  • Multiphysics simulation
  • Structured design methodologies
  • Languages for interchange data among designs and tools
  • Model order reduction

Program Committee

  • Shuhei AMAKAWA, Hiroshima University, Japan
  • Arturo AYON, Univ. of Texas at San Antonio, USA
  • Elena BLOKHINA, University College Dublin, Ireland
  • Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
  • Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
  • Péter FURJES, Institute for Technical Physics and Materials Science, Hungary
  • Dimitri GALAYKO, Pierre and Marie Curie Univ., Paris VI, France, France
  • Jerome JUILLARD, Supélec, France
  • Raphaël LEVY, ONERA, France
  • Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
  • Frédérick MAILLY, LIRMM, University of Montpellier, France
  • Romolo MARCELLI, CNR-IMM Roma, Italy
  • Mohamed MASMOUDI, University of Sfax, Tunisia
  • Raluca MULLER, IMT - Bucharest, Romania
  • Anis Nurashikin NORDIN, International Islamic University, Malaysia
  • Andrew RICHARDSON, Lancaster University, UK
  • Bart ROMANOWICZ, Nano Science & Technology Institute, Austin, USA
  • Ray ROOP, Freescale Semiconductor, USA
  • Libor RUFER, University of Grenoble, France
  • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
  • Gerold SCHROEPFER, Coventor, France
  • Mahnaz SHAMSHIRSAZ, Amirkabir University of Technology, Iran
  • Jian ZHU, Nanjing Electronic Devices Institute, China

Microfabrication, Integration and Packaging Conference

  • Chair: Yoshio Mita, University of Tokyo, Japan

  • Co-Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

Topics of Interest

  • Integrated processes (micromachining, micromolding, …)
  • Process integration between MEMS and electronics
  • Microlithography issues unique to MEMS/MOEMS
  • Manufacturing
  • Materials
  • Assembly technologies
  • Packaging for harsh environments
  • MOEMS packaging
  • RF and microwave packaging
  • Test structures
  • Devices and components (sensors, actuators, …)
  • Dimensional measurements
  • Physical measurements
  • Failure analysis
  • Reliability
  • Characterization
  • Process monitoring
  • Non destructive evaluation

Program Committee

  • Knut AASMUNDTVEIT, HBV, Buskerud and Vestfold University College, Norway
  • Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
  • Philippe BASSET, Université Paris-Est / ESYCOM / ESIEE Paris, France
  • Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
  • Victor BRIGHT, Univ. of Colorado Boulder, USA
  • Henri CAMON, LAAS-CNRS, France
  • Benoit CHARLOT, IES, CNRS/Université Montpellier, France
  • Alexandra GARRAUD, University of Florida, USA
  • Toshihiro ITOH, AIST (National Institute of Advanced Industrial Science and Technology), Japan
  • Elie LEFEUVRE, Université Paris Sud - CNRS, France
  • Alan MATHEWSON, Tyndall National Institute, Ireland
  • Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
  • Yves-Alain PETER, EPM, Montréal, Canada, Canada
  • Emanuela PROIETTI, Institute for Microelectronics and Microsystems, Roma, Italy
  • Xuechuan SHAN, SIMTech, Singapore, Singapore
  • Diana STRICKLAND, Southwest Research Institute, San Antionio, USA
  • Andrew A O TAY, National Univ. of Singapore, Singapore
  • Li TIE, SIMIT, CAS, China
  • Dong F. WANG, Jilin Univ., Changchun, China
  • Gou-Jen WANG, National Chung-Hsing University, Taiwan
  • Matthias WORGULL, KIT, Karlsruhe, Germany
  • Hsiharng YANG, National Chung Hsing Univ., Taiwan, Taiwan
  • Xuming ZHANG, Hong Kong Polytechnic university, Hong-Kong
  • Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA

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