Computer-Aided Design, Design and Test

 

• Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany


• Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Topics of Interest

CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators




Technical Program Committee

• Shuhei AMAKAWA, Hiroshima University, Japan
• Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
• Elena BLOKHINA, University College Dublin, Ireland
• Rainer BRUCK, University of Siegen, Germany
• Giorgio DE PASQUALE, DIMEAS, Politecnico di Torino, Italy
• Dimitri GALAYKO, Pierre and Marie Curie Univ., Paris VI, France, France
• Jerome JUILLARD, Supélec, France
• Raphaël LEVY, ONERA, France
• Holden LI, NTU, school of Mechanical and Aerospace, Singapore
• Frédérick MAILLY, LIRMM, University of Montpellier, France
• Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
• Paul POP, Technical Univ. of Denmark, Lyngby, Denmark
• Andras POPPE, Mentor Graphics , Hungary
• Marta RENCZ, BME, Budapest, Hungary
• Andrew RICHARDSON, Lancaster University, UK
• Bart ROMANOWICZ, Nano Science & Technology Institute, Austin, USA
• Libor RUFER, University of Grenoble, France
• Gabriele SCHRAG, TU Munich, Germany
• Gerold SCHROPFER, Coventor, France
• Mahnaz SHAMSHIRSAZ, Amirkabir University of Technology, Iran
• Aurelio SOMA, Politecnico di Torino, Italy, Italy

Microfabrication, Integration and Packaging
 

• Chair: Yoshio Mita, University of Tokyo, Japan


• Co-Chair: Niels Tas, MESA+ Institute for Nanotechnology, Twente, NL

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

Topics of Interest

• MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others

INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

MATERIALS: piezoelectric, PDMS, others

CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Knut AASMUNDTVEIT, HBV, Buskerud and Vestfold University College, Norway
• Arturo AYON, Univ. of Texas at San Antonio, USA
• Philippe BASSET, Université Paris-Est / ESYCOM / ESIEE Paris, France
• Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
• Victor BRIGHT, Univ. of Colorado Boulder, USA
• Henri CAMON, LAAS-CNRS, France
• Benoit CHARLOT, IES, CNRS/Université Montpellier, France
• Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
• Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
• Alexandra GARRAUD, University of Florida, USA
• Kristin IMENES, HBV, Norway
• Toshihiro ITOH, AIST (National Institute of Advanced Industrial Science and Technology), Japan
• Elie LEFEUVRE, Université Paris Sud - CNRS, France
• Holden LI, NTU, school of Mechanical and Aerospace, Singapore
• Tie LI, SIMIT, CAS, China
• Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France, France
• Romolo MARCELLI, CNR-IMM Roma, Italy
• Mohamed MASMOUDI, University of Sfax, Tunisia
• Raluca MULLER, IMT - Bucharest, Romania
• Anis Nurashikin NORDIN, International Islamic University, Malaysia
• Yves-Alain PETER, EPM, Montréal, Canada, Canada
• Emanuela PROIETTI, Institute for Microelectronics and Microsystems, Roma, Italy
• Ray ROOP, Freescale Semiconductor, USA
• John TUDOR, University of Southampton, UK
• Dong F. WANG, Jilin Univ., Changchun, China
• Gou-Jen WANG, National Chung-Hsing University, Taiwan
• Zhenfeng WANG, SIMTech, Singapore, Singapore
• Matthias WORGULL, KIT, Karlsruhe, Germany, Germany
• Hsiharng YANG, National Chung Hsing Univ., Taiwan, Taiwan
• Jian ZHU, Nanjing Electronic Devices Institute, China
• Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA