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Paris - France, May 12th - May 15th, 2019
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Chairs

  • General: Pascal Nouet, University of Montpellier, FR
  • Local organization co-chairs:
    Elie Lefeuvre, University Paris-Sud XI, FR
    Jérôme Juillard, CentraleSupélec, FR
  • Publication chair:
  • Frédéric Mailly, University of Montpellier, FR

Contact information

What's new?

  • December, 2nd, 2018: New deadline to submit regular paper is December, 16th (hard deadline)...
  • November, 29th, 2018: Special Session on "MEMS devices in a standard process" is accepting proposals (deadline January, 13th, see Call for Papers page)...
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ABOUT THE DTIP SYMPOSIUM

DTIP'2019 will be the 20th anniversary edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks.  Papers presented at the conference will appear in IEEE Xplore and extended version of the presented papers may be submitted for inclusion in a special issue of an indexed journal.
We look forward to welcoming you in Paris next Spring.
Elie Lefeuvre, Jérôme Juilliard & Pascal Nouet

Please feel free to download DTIP'2019 Call for Paper

Computer-Aided Design, Design and Test Conference

  • Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany

  • Co-Chair: Francis Pressecq, CNES, France


This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Microfabrication, Integration and Packaging Conference

  • Chair: Stewart Smith, The University of Edinburgh, Scotland

  • Co-Chair: Yoshio Mita, The University of Tokyo, Japan


This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. 

Plenary Sessions
The symposium program will include  three plenary sessions with invited talks and/or technical panels.

Feel free to propose topics to be adressed and/or to nominate colleagues for an invited talk by email (dtip@dtip-mems.org) at your earliest convenience.


Special Sessions
For those of you, who intend to propose a special session, feel free to propose a topic by email (dtip@dtip-mems.org) as soon as possible.

When proposing a special session, please mention how many submitted papers can be expected.

Special session organizers will be responsible for attracting papers, organizing the review and making the final selection.

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