DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers.

Expected DTIP 2025 submissions are 4-6 pages papers

2-3 pages abstracts will be accepted for poster contributions

Even if shorter papers will be considered, it is highly recommended to submit full 4-6 pages papers for efficient and fair scientific reviewing.

Detailed instructions regarding electronic submissions will be posted on the DTIP website.

Note: Companies that want to advertise their products are discouraged to submit a research paper if there is no strong scientific contribution compared to the state-of-the-art. For communication purposes, it is recommended to participate as a sponsor/exhibitor. 

The submission website setup is in progress and will b available soon

Special sessions

For those of you, who intend to propose a special session, feel free to propose a topic by email (dtip@dtip-mems.org) at your earliest convenience.

Invited talks and panels

The symposium program will include plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be addressed and/or to nominate colleagues for an invited talk.