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Roma - Italy, May 22nd - May 25th, 2018
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Research paper submission
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers. Even if abstracts of about 600 words will be considered, it is recommended to submit extended abstracts (up to 1500 words) plus one page of figures for efficient and fair scientific reviewing. Detailed instructions regarding electronic submissions are posted on the "Authors Information" section of the DTIP website.
Questions may be directed in the meantime by e-mail (

Product-oriented papers

Companies that want to advertise their products (such as sensors, equipments or CAD tools) are discouraged to submit a research paper if there is no revelation of any scientific contribution or rupture with respect to the state-of-the-art. In that case, it is recommended to consider becoming a sponsor of the conference to benefit from a large audience (an oral presentation in a plenary session).

some text Access to Paper Submission Website

Special sessions
For those of you, who intend to propose a special session, feel free to propose a topic by email ( at your earliest convenience. When proposing a special session, please mention how many submissions are expected. Once selected by the chairs of the symposium, special session organizers will be responsible for attracting papers, organizing the review and making the final selection with the support of the DTIP organization. Please refer to the program of past editions to have an overview of previous special sessions.

Invited talks and panels
The symposium program will include three plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be adressed and/or to nominate colleagues for an invited talk by email ( at your earliest convenience.

Complete Call for Papers (in pdf)

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