Pont-a-Mousson, July 11th - 13th, 2022

Local committee

The local Committee of DTIP organizes the local arrangements for successful venue, accomodation, welcome, and the environment that promotes fruitful scientific exchanges during the symposium.

Local Committee Members:
  • Sami HAGE-ALI, IJL, Univ. Lorraine-CNRS, Nancy, France
  • Omar ELMAZRIA, IJL, Univ. Lorraine-CNRS, France
  • Cécile FLOER, IJL, Univ. Lorraine-CNRS, Nancy, France
  • Thierry AUBERT,  LMOPS, Univ. Lorraine-CentraleSupelec, Metz, France
  • Frédéric SARRY, IJL, Univ. Lorraine-CNRS, Nancy, France

  • Steering Committee

    The Steering Committee of DTIP oversees the long-term planning and success of current instances of the Symposium; plans for future conferences in the series; evaluates how well each conference has achieved its objectives; proposes and implements improvements to continuously meet these objectives.
    The Steering Committee is responsible for making strategic decisions, including but not limited to: the appointment of the Local Organization Chair and Technical Program Chairs (including removal and reappointment if necessary); providing guidance, oversight, and support for the Executive Committees of instances of the conference; selection of conference dates and locations; determining the major theme of the conference; coordination amongst partners; creation or approval of any conference specific policies; enforcement of ethical policies; and reviewing the budget. 

    Technical Program Committee

    DTIP’2021 is organized as a set of two conferences in a unique scientific event. Attendees will be able to follow the integrality of the program either live or using the replay option. Both conferences have their own topics of interest and Program Committee as listed below.

    Computer-Aided Design, Design and Test

    • Conference co-Chairs:
    • Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany
    • Jérôme Juillard, CentraleSupelec, France

    This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

    Topics of Interest

    CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

    DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

    TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

    Technical Program Committee

    • Mehdi AZADMEHR, HBV Buskerud and Vestfold University College, Norway
    • Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
    • Abe Elfadel, Khalifa University, UAE
    • Dooyoung HAH, Abdullah Gul University, Turkey
    • Akio HIGO, The University of Tokyo, Japan
    • Elie LEFEUVRE, Université Paris Sud - CNRS, France
    • Jan MADSEN, Technical University of Denmark, Denmark
    • Frédérick MAILLY, LIRMM, University of Montpellier, France
    • Romolo MARCELLI, CNR-IMM Roma, Italy
    • Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
    • Jan Edgar MEHNER, TU Chemnitz, Germany
    • Yoshio MITA, The University of Tokyo, Japan
    • Yves-Alain PETER, EPM, Montréal, Canada
    • Francis PRESSECQ, CNES, France
    • Emanuela PROIETTI, CNR-IMM Roma, Italy
    • Marius PUSTAN, Technical University of Cluj-Napoca, Romania
    • John TUDOR, University of Southampton, UK
    • Dong F. WANG, Jilin Univ., Changchun, China
    • Xuming ZHANG, Hong Kong Polytechnic university, Hong-Kong

    Microfabrication, Integration and Packaging
    • Conference co-Chairs:
    • Stewart Smith, The University of Edinburgh, Scotland
    • Abdelkrim Talbi, Univ. Lille, France

    This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

    Topics of Interest

    MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others
    INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies
    PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others
    MATERIALS: piezoelectric, PDMS, others
    CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis
    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

    Technical Program Committee

    • Steeve BEEBY, University of Southampton, UK
    • Corina BIRLEANU, Technical University of Cluj-Napoca, Romania
    • Alain BOSSEBOEUF, C2N/CNRS-Université Paris-Sud, France
    • Victor BRIGHT, Univ. of Colorado Boulder, USA
    • Stéphane CAPRARO, laboratoire Hubert Curien, Saint Etienne, France
    • Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
    • Péter FURJES, Institute for Tech. Physics and Materials Science, Hungary
    • Alexandra GARRAUD, Enerbee, Grenoble, France
    • Cécile GHOUILA-HOURI, IEMN - Centrale Lille, France
    • Hamida HALLIL, IMS-University of Bordeaux, France
    • Takayuki KIBA, Kitami Institute of Technology, Japan
    • Holden LI, NTU, school of Mechanical and Aerospace, Singapore
    • Tie LI, SIMIT, CAS, China
    • Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
    • Zakriya MOHAMMED, Khalifa University , UAE
    • Johan MOULIN, Univ. Paris Sud, France
    • Raluca MULLER, IMT - Bucharest, Romania
    • Louis RENAUD, INL, Université de Lyon, France
    • Jérôme ROSSIGNOL, ICB - Universite de Bourgogne, France
    • Gou-Jen WANG, National Chung-Hsing University, Taiwan
    • Zhenfeng WANG, SIMTech, Singapore
    • Jian ZHU, Nanjing Electronic Devices Institute, China

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