Computer-Aided Design, Design and Test

 

• Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany


• Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Topics of Interest

CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
• Corina BIRLEANU, Technical University of Cluj-Napoca, Romania
• Elena BLOKHINA, University College Dublin, Ireland
• Henri CAMON, LAAS-CNRS, France
• Marija CAUCHI, University of Malta, Malta
• Benoit CHARLOT, IES, CNRS/University of Montpellier, France
• Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
• Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
• Alina CISMARU, IMT Bucharest, Romania
• Danilo DEMARCHI, Politecnico di Torino, Italy
• Abe ELFADEL, Khalifa University, UAE
• Jerome JUILLARD, Supélec, France
• Michael KRAFT, KU Leuven, Belgium
• Laurent LATORRE, LIRMM, University of Montpellier, France
• Raphaël LEVY, ONERA, France
• Holden LI, NTU, school of Mechanical and Aerospace, Singapore
• Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
• Frédérick MAILLY, LIRMM, University of Montpellier, France
• Jan MEHNER, TU Chemnitz, Germany
• Zakriya MOHAMMED, Khalifa University , UAE
• Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA, USA
• Elyes NEFZAOUI, ESIEE Paris, FRANCE
• Bart ROMANOWICZ, Nano Science & Technology Institute, Austin, USA
• Gabriele SCHRAG, TU Munich, Germany
• Gerold SCHROPFER, Coventor, France
• Vladimir SOBOLEV, South Dakota School of Mines and Technology, USA
• Aurelio SOMA, Politecnico di Torino, Italy
• Ralf SOMMER, TU Ilmenau, Germany

Microfabrication, Integration and Packaging
 

• Chair: Stewart Smith, The University of Edinburgh, Scotland


• Co-Chair: Yoshio Mita, The University of Tokyo, Japan

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

Topics of Interest

MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others
INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

MATERIALS: piezoelectric, PDMS, others

CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Victor BRIGHT, Univ. of Colorado Boulder, USA
• Stéphane CAPRARO, laboratoire Hubert Curien, Saint Etienne, France
• Olivier Français, SATIE, France
• Alexandra GARRAUD, LTM - Université Grenoble Alpes, France
• Dooyoung HAH, Abdullah Gul University, Turkey
• Hamida HALLIL, IMS-University of Bordeaux, France
• Akio HIGO, The University of Tokyo, Japan
• Toshihiro ITOH, University Tokyo & AIST, Japan
• Erik JUNG, Fraunhofer IZM, Germany, Germany
• Elie LEFEUVRE, Université Paris Sud - CNRS, France
• Tie LI, SIMIT, CAS, China
• Romolo MARCELLI, CNR-IMM Roma, Italy
• Mohamed MASMOUDI, University of Sfax, Tunisia
• Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
• Johan MOULIN, Univ. Paris Sud, France
• Raluca MULLER, IMT - Bucharest, Romania
• Claude PELLET, IMS-University of Bordeaux, France
• Yves-Alain PETER, EPM, Montréal, Canada
• Marius PUSTAN, Technical University of Cluj-Napoca, Romania
• Peter RAMM, Fraunhofer EMFT , Germany
• Marta RENCZ, BME, Budapest, Hungary
• Libor RUFER, University of Grenoble, France
• Giovanni SARDI, CNR - IMM, Italy
• Xuechuan SHAN, SIMTech, Singapore
• Niels TAS, MESA+ Institute for Nanotechnology, Netherlands
• John TUDOR, University of Southampton, UK
• Dong F. WANG, Jilin Univ., Changchun, China
• Gou-Jen WANG, National Chung-Hsing University, Taiwan
• Zhenfeng WANG, SIMTech, Singapore
• Matthias WORGULL, KIT, Karlsruhe, Germany
• Hsiharng YANG, National Chung Hsing Univ., Taiwan
• Jian ZHU, Nanjing Electronic Devices Institute, China
• Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA