Virtual event, August 25th - 27th, 2021 |
The Steering Committee of DTIP oversees the long-term planning and success of current instances of the Symposium; plans for future conferences in the series; evaluates how well each conference has achieved its objectives; proposes and implements improvements to continuously meet these objectives.
The Steering Committee is responsible for making strategic decisions, including but not limited to: the appointment of the Local Organization Chair and Technical Program Chairs (including removal and reappointment if necessary); providing guidance, oversight, and support for the Executive Committees of instances of the conference; selection of conference dates and locations; determining the major theme of the conference; coordination amongst partners; creation or approval of any conference specific policies; enforcement of ethical policies; and reviewing the budget.
Steering Committee Members:
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DTIP’2021 is organized as a set of two conferences in a unique scientific event. Attendees will be able to follow the integrality of the program either live or using the replay option. Both conferences have their own topics of interest and Program Committee as listed below.
This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. Topics of Interest CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologiesDESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators Technical Program Committee
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This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. Topics of Interest MICROFABRICATION: assembly technologies, microlithography issues for MEMS/MOEMS, micromachining, micro-molding, nano-imprint, embossing, othersINTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others MATERIALS: piezoelectric, PDMS, others CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators Technical Program Committee
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