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Virtual event, August 25th - 27th, 2021

Steering Committee

The Steering Committee of DTIP oversees the long-term planning and success of current instances of the Symposium; plans for future conferences in the series; evaluates how well each conference has achieved its objectives; proposes and implements improvements to continuously meet these objectives.
 
The Steering Committee is responsible for making strategic decisions, including but not limited to: the appointment of the Local Organization Chair and Technical Program Chairs (including removal and reappointment if necessary); providing guidance, oversight, and support for the Executive Committees of instances of the conference; selection of conference dates and locations; determining the major theme of the conference; coordination amongst partners; creation or approval of any conference specific policies; enforcement of ethical policies; and reviewing the budget. 

Steering Committee Members:
  • Arturo AYON, Univ. of Texas at San Antonio, USA
  • Alain BOSSEBOEUF, C2N/CNRS-Univ. Paris-Saclay, France
  • Henri CAMON, LAAS-CNRS, France
  • Jerome JUILLARD, Supélec, France
  • Elie LEFEUVRE, Univ. Paris Sud - CNRS, France
  • Frédérick MAILLY, LIRMM, Univ. Montpellier, France
  • Yoshio MITA, The University of Tokyo, Japan
  • Pascal NOUET, LIRMM, Univ. of Montpellier, France
  • Francis PRESSECQ, CNES, Toulouse, France
  • Marta RENCZ, BME, Budapest, Hungary
  • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
  • Gerold SCHROPFER, Coventor, France
  • Stewart SMITH, The University of Edinburgh, UK


  • Technical Program Committee

    DTIP’2021 is organized as a set of two conferences in a unique scientific event. Attendees will be able to follow the integrality of the program either live or using the replay option. Both conferences have their own topics of interest and Program Committee as listed below.


    Computer-Aided Design, Design and Test

    • Conference co-Chairs:
    • Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany
    • Jérôme Juillard, CentraleSupelec, France

    This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
     

    Topics of Interest

    CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

    DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

    TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators


    Technical Program Committee

    • Shuhei AMAKAWA, Hiroshima University, Japan
    • Mehdi AZADMEHR, HBV Buskerud and Vestfold University College, Norway
    • Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
    • Giorgio DE PASQUALE, DIMEAS, Politecnico di Torino, Italy
    • Abe ELFADEL, Khalifa University, UAE
    • Dimitri GALAYKO, Pierre and Marie Curie Univ., Paris VI, France
    • Raphaël LEVY, ONERA, France
    • Jan MADSEN, Technical University of Denmark, Denmark
    • Frédérick MAILLY, LIRMM, University of Montpellier, France
    • Gerold SCHROPFER, Coventor, France
    • Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA

    Microfabrication, Integration and Packaging
     
    • Conference co-Chairs:
    • Stewart Smith, The University of Edinburgh, Scotland
    • Abdelkrim Talbi, Univ. Lille, France

    This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

    Topics of Interest

    MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others
     
    INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

    PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

    MATERIALS: piezoelectric, PDMS, others

    CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

    Technical Program Committee

    • Knut AASMUNDTVEIT, HBV Buskerud and Vestfold University College, Norway
    • Alain BOSSEBOEUF, C2N/CNRS-Université Paris-Sud, France
    • Victor BRIGHT, Univ. of Colorado Boulder, USA
    • Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
    • Corinne DEJOUS, Univ. Bordeaux, France
    • Stéphane CAPRARO, laboratoire Hubert Curien, Saint Etienne, France
    • Péter FURJES, Institute for Tech. Physics and Materials Science, Hungary
    • Alexandra GARRAUD, LTM - Université Grenoble Alpes, France
    • Dooyoung HAH, Abdullah Gul University, Turkey
    • Takayuki KIBA, Kitami Institute of Technology, Japan
    • Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
    • Romolo MARCELLI, CNR-IMM Roma, Italy
    • Emile MARTINCIC, Univ. Paris-Saclay, France
    • Raluca MULLER, IMT - Bucharest, Romania
    • Yves-Alain PETER, EPM, Montréal, Canada
    • Louis RENAUD, INL, Université de Lyon, France
    • Niels TAS, MESA+ Institute for Nanotechnology, Netherlands
    • John TUDOR, University of Southampton, UK
    • Dong F. WANG, Jilin Univ., Changchun, China
    • Jian ZHU, Nanjing Electronic Devices Institute, China

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