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Roma - Italy, May 22nd - May 25th, 2018
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In-line with previous editions, DTIP’2018 will be a scientific event with two main conferences running in parallel, along with special sessions and plenary invited talks.

Computer-Aided Design, Design and Test

 
  • Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany

  • Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.


Topics of Interest

    CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

    DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

    TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators


    Technical Program Committee

    to be completed...

Microfabrication, Integration and Packaging
 

  • Chair: Stewart Smith, The University of Edinburgh, Scotland

  • Co-Chair: Yoshio Mita, The University of Tokyo, Japan

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.


Topics of Interest

  • MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others

INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

MATERIALS: piezoelectric, PDMS, others

CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

to be completed...

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