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Virtual event, June 15th - June 26th, 2020
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DTIP2020 – Virtual event – June 15th to June 26th, 2020
Don’t miss the premier European scientific event on Microsystems, MEMS and MOEMS >> Save the date!!!

DTIP’2019 (held in Paris) was extremely appreciated by about one hundred attendees for the quality of both scientific and social programs. Oral and poster presentations were carefully selected by the Technical Program Committee to insure a high scientific level and awesome plenary speakers have been invited. DTIP is definitively the premier MEMS scientific conference in Europe.

If you missed the last DTIP, do not miss the scientific articles published in the IEEE Xplore database...
In-line with previous editions, DTIP’2020 will be a scientific event with two main conferences, special sessions and invited talks. In order to encourage the presentation of recent and innovative research contributions, submission deadline has been set as close as possible to the event. Final papers will be due on the week before the first day of the conference to appear in IEEE Xplore. Submission to a special issue of an indexed journal will also be encouraged for the best papers.
Important dates are as follows:
Extended abstract submission: January 31st, 2020 February 16th, 2020 (see submission template on the author page)
Notification of acceptance: March 13th, 2020 March 27th, 2020
Early-bird registration: April 17th, 2020
IEEE Xplore camera-ready final version (4 to 6 pages, IEEE Format): June 1st, 2020

Product-oriented papers
Companies that want to advertise their products (such as sensors, equipment or CAD tools) are discouraged to submit a research paper if there is no revelation of any scientific contribution or rupture with respect to the state-of-the-art. In that case, it is recommended to consider becoming an exhibitor at the conference to benefit from a large audience (an oral presentation in a plenary session and a stand). Please visit the Sponsor/Exhibitors page.
Questions may be directed in the meantime by e-mail (

Research paper submission
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submissions. Extended abstracts of about one page of text plus one page of figures will be considered.
Detailed instructions regarding electronic submissions is available on the Authors page.

Special sessions
For those of you, who intend to propose a special session, feel free to propose a topic by email ( at your earliest convenience.
When proposing a special session, please mention how many submissions are expected. Special session organizers will be responsible for attracting papers, organizing the review and making the final selection with the support of the DTIP organization.
Please refer to the program of past editions to have an overview of previous special sessions.

Invited talks and panels

The symposium program will include three plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be addressed and/or to nominate colleagues for an invited talk by email ( at your earliest convenience.

Looking forward to have you on-board for this 22nd edition of DTIP,
Henri Camon, Yoshio Mita, Peter Schneider and Stewart Smith, Conference Program co-Chairs
Frédérick Mailly, Publication Chair
Pascal Nouet, General Chair

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