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Virtual event, June 15th - June 26th, 2020
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Steering Committee

The Steering Committee of DTIP oversees the long-term planning and success of current instances of the Symposium; plans for future conferences in the series; evaluates how well each conference has achieved its objectives; and proposes and implements improvements to continuously meet these objectives.
The Steering Committee is responsible for making strategic decisions, including but not limited to: the appointment of the Local Organization Chair and Technical Program Chairs (including removal and reappointment if necessary); providing guidance, oversight, and support for the Executive Committees of instances of the conference; selection of conference dates and locations; determining the major theme of the conference; coordination amongst partners; creation or approval of any conference specific policies; enforcement of ethical policies; and reviewing the budget. 

Steering Committee composition:
  • Arturo AYON, Univ. of Texas at San Antonio, USA
  • Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
  • Henri CAMON, LAAS-CNRS, France
  • Jerome JUILLARD, Supélec, France
  • Elie LEFEUVRE, Université Paris Sud - CNRS, France
  • Frédérick MAILLY, LIRMM, University of Montpellier, France
  • Yoshio MITA, The University of Tokyo, Japan
  • Pascal NOUET, LIRMM, University of Montpellier, France
  • Francis PRESSECQ, CNES, Toulouse, France
  • Marta RENCZ, BME, Budapest, Hungary
  • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
  • Gerold SCHROPFER, Coventor, France
  • Stewart SMITH, The University of Edinburgh, UK
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    Technical Program Committee

    DTIP’2020 is organized as a set of two conferences in a unique scientific event. As a virtual event, attendees will be able to follow the integrality of the program either live or using the replay option. Both conferences have their own topics of interest and Program Committee as listed below.


    Computer-Aided Design, Design and Test

     
    • Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany

    • Co-Chair: Henri Camon, LAAS, France

    This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.


    Topics of Interest

    CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

    DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

    TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators


    Technical Program Committee

    • Shuhei AMAKAWA, Hiroshima University, Japan
    • Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
    • Alina CISMARU, IMT Bucharest, Romania
    • Giorgio DE PASQUALE, DIMEAS, Politecnico di Torino, Italy
    • Abe ELFADEL, Khalifa University, UAE
    • Hamida HALLIL, IMS-University of Bordeaux, France
    • Akio HIGO, The University of Tokyo, Japan
    • Laurent LATORRE, LIRMM, University of Montpellier, France
    • Frédérick MAILLY, LIRMM, University of Montpellier, France
    • Francis PRESSECQ, CNES, France
    • Bart ROMANOWICZ, Nano Science & Technology Institute, Austin, USA
    • Libor RUFER, University of Grenoble, France
    • Giovanni SARDI, CNR - IMM, Italy
    • Gabriele SCHRAG, TU Munich, Germany

    Microfabrication, Integration and Packaging
     

    • Chair: Stewart Smith, The University of Edinburgh, Scotland

    • Co-Chair: Yoshio Mita, The University of Tokyo, Japan

    This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.


    Topics of Interest

    MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others
    INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

    PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

    MATERIALS: piezoelectric, PDMS, others

    CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

    DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

    Technical Program Committee

    • Knut AASMUNDTVEIT, HBV Buskerud and Vestfold University College, Norway
    • Thomas ALAVA, CEA LETI, France
    • Cédric AYELA, IMS-University of Bordeaux, France
    • Arturo AYON, Univ. of Texas at San Antonio, USA
    • Victor BRIGHT, Univ. of Colorado Boulder, USA
    • Stéphane CAPRARO, laboratoire Hubert Curien, Saint Etienne, France
    • Péter FURJES, Institute for Tech. Physics and Materials Science, Hungary
    • Alexandra GARRAUD, LTM - Université Grenoble Alpes, France
    • Kun GENG, Google Inc. / Waymo, Mountain View, CA, USA
    • Dooyoung HAH, Abdullah Gul University, Turkey
    • Takayuki KIBA, Kitami Institute of Technology, Japan
    • Holden LI, NTU, school of Mechanical and Aerospace, Singapore
    • Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
    • Johan MOULIN, Univ. Paris Sud, France
    • Elyes NEFZAOUI, ESIEE Paris, FRANCE
    • Yves-Alain PETER, EPM, Montréal, Canada
    • Xuechuan SHAN, SIMTech, Singapore
    • Niels TAS, MESA+ Institute for Nanotechnology, Netherlands
    • John TUDOR, University of Southampton, UK
    • Dong F. WANG, Jilin Univ., Changchun, China
    • Matthias WORGULL, KIT, Karlsruhe, Germany
    • Jian ZHU, Nanjing Electronic Devices Institute, China

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